Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/4491

Title:	Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers
Authors:	Lau, J. H. Li, M. Yang, L. Xu, I. Chen, T. Chen, S. Yong, Q. X. Madhukumar, J. P. Wu Kai Fan, N. Kuah, E. Li, Z. Tan, K. H. Bao, W. Lim, S. P. Beica, R. Ko, C. T. Xi, C.
Issue Date:	Oct-2018
Journal Volume:	8
Journal Issue:	10
Source:	Ieee Transactions on Components Packaging and Manufacturing Technology
URI:	http://scholars.ntou.edu.tw/handle/123456789/4491
ISSN:	2156-3950
DOI:	10.1109/tcpmt.2018.2848666 ://WOS:000447078400003 ://WOS:000447078400003
Appears in Collections:	光電與材料科技學系

Show full item record

Last Week
0

Last month
0

checked on Oct 13, 2022

Check

DSpace CRIS