Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/4490

Title:	Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
Authors:	Lau, J. H. Li, M. Tian, D. W. Fan, N. Kuah, E. Wu Kai Hao, J. Cheung, Y. M. Li, Z. Tan, K. H. Beica, R. Taylor, T. Ko, C. T. Yang, H. Chen, Y. H. Lim, S. P. Lee, N. C. Ran, J. Xi, C. Wee, K. S. Yong, Q. X.
Issue Date:	Oct-2017
Journal Volume:	7
Journal Issue:	10
Source:	Ieee Transactions on Components Packaging and Manufacturing Technology
URI:	http://scholars.ntou.edu.tw/handle/123456789/4490
ISSN:	2156-3950
DOI:	10.1109/tcpmt.2017.2715185 ://WOS:000412631100018
Appears in Collections:	光電與材料科技學系

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