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請用此 Handle URI 來引用此文件: http://scholars.ntou.edu.tw/handle/123456789/17546
標題: Curved-Mechanical Characteristic Measurements of Transparent Conductive Film-Coated Polymer Substrates Using Common-Path Optical Interferometry
作者: Wen, Bor-Jiunn 
Hsu, Jui-Jen
關鍵字: curved-mechanical characteristic measurements;whole-folding test;transparent conductive film-coated polymer substrate;common-path optical interferometry
公開日期: 1-七月-2021
出版社: MDPI
卷: 11
期: 7
來源出版物: COATINGS
摘要: 
This study proposes a method for measuring curved-mechanical characteristics based on a whole-folding test for transparent conductive film-coated polymer substrates using common-path optical interferometry. Accordingly, 80-, 160-, and 230-nm indium tin oxide films coated on 40 x 40 mm 125-mu m-thick polyethylene terephthalate (PET) substrates, and monolayer graphene films coated on 40 x 40 mm 250-mu m-thick PET substrates are inspected and analyzed under the curving conditions of 50-, 30-, 20-, and 10-mm radii before and after an 11,000 whole-folding cycle test based on a 10-mm folding radius. This study utilizes the changes in the phase retardations of transparent conductive film-coated polymer substrates under different curving conditions before and after 11,000 whole-folding cycles to analyze the substrates' residual stress characteristics that were the direct result of manufacturing process parameters. The results from this study of curved-mechanical characteristic measurements of flexible transparent conductive substrates can provide designers with improved product development and can assist manufacturers in improving the manufacturing design of enhanced coating processes.
URI: http://scholars.ntou.edu.tw/handle/123456789/17546
DOI: 10.3390/coatings11070766
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