http://scholars.ntou.edu.tw/handle/123456789/3103| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chiou, Y. C. | en_US |
| dc.contributor.author | Yi-Ming Jen | en_US |
| dc.contributor.author | Huang, S. H. | en_US |
| dc.date.accessioned | 2020-11-18T02:42:55Z | - |
| dc.date.available | 2020-11-18T02:42:55Z | - |
| dc.date.issued | 2011-12 | - |
| dc.identifier.issn | 0026-2714 | - |
| dc.identifier.uri | http://scholars.ntou.edu.tw/handle/123456789/3103 | - |
| dc.relation.ispartof | Microelectronics Reliability | en_US |
| dc.title | Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth | en_US |
| dc.type | journal article | en_US |
| dc.identifier.doi | 10.1016/j.microrel.2011.06.025 | - |
| dc.identifier.doi | <Go to ISI>://WOS:000298721500047 | - |
| dc.identifier.url | <Go to ISI>://WOS:000298721500047 | |
| dc.relation.journalvolume | 51 | en_US |
| dc.relation.journalissue | 12 | en_US |
| item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
| item.cerifentitytype | Publications | - |
| item.fulltext | no fulltext | - |
| item.grantfulltext | none | - |
| item.openairetype | journal article | - |
| Appears in Collections: | 機械與機電工程學系 | |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.