Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/3103

Title:	Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth
Authors:	Chiou, Y. C. Yi-Ming Jen Huang, S. H.
Issue Date:	Dec-2011
Journal Volume:	51
Journal Issue:	12
Source:	Microelectronics Reliability
URI:	http://scholars.ntou.edu.tw/handle/123456789/3103
ISSN:	0026-2714
DOI:	10.1016/j.microrel.2011.06.025 ://WOS:000298721500047
Appears in Collections:	機械與機電工程學系

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