Residual Stress Image Inspections Based on Bending Testing for Flexible Transparent Conducting Substrates by Single-Direction Common-Path Image Interferometry

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/3517

Title:	Residual Stress Image Inspections Based on Bending Testing for Flexible Transparent Conducting Substrates by Single-Direction Common-Path Image Interferometry
Authors:	Bor-Jiunn Wen Huang, S. A.
Issue Date:	Mar-2019
Journal Volume:	19
Journal Issue:	5
Source:	Ieee Sensors Journal
URI:	http://scholars.ntou.edu.tw/handle/123456789/3517
ISSN:	1530-437X
DOI:	10.1109/jsen.2018.2881426
Appears in Collections:	機械與機電工程學系

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