http://scholars.ntou.edu.tw/handle/123456789/3112| Title: | Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages | Authors: | Yi-Ming Jen Chien, H. H. Lin, T. S. Huang, S. H. |
Issue Date: | 2006 | Journal Volume: | 306-308 | Source: | Fracture and Strength of Solids Vi, Pts 1 and 2 | URI: | http://scholars.ntou.edu.tw/handle/123456789/3112 | DOI: | 10.4028/www.scientific.net/KEM.306-308.1043 |
| Appears in Collections: | 機械與機電工程學系 |
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