http://scholars.ntou.edu.tw/handle/123456789/3114| Title: | Fracture mechanics study on the intermetallic compound cracks for the solder joints of electronic packages | Authors: | Yi-Ming Jen Chiou, Y. C. Yu, C. L. |
Issue Date: | Mar-2011 | Journal Volume: | 18 | Journal Issue: | 2 | Source: | Engineering Failure Analysis | URI: | http://scholars.ntou.edu.tw/handle/123456789/3114 | ISSN: | 1350-6307 | DOI: | 10.1016/j.engfailanal.2010.12.026 |
| Appears in Collections: | 機械與機電工程學系 |
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