Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages

Please use this identifier to cite or link to this item: http://scholars.ntou.edu.tw/handle/123456789/3115

Title:	Effect of size of lid-substrate adhesive on reliability of solder balls in thermally enhanced flip chip PBGA packages
Authors:	Yi-Ming Jen Fang, C. K. Yeh, Y. H.
Issue Date:	Dec-2006
Journal Volume:	29
Journal Issue:	4
Source:	Ieee Transactions on Components and Packaging Technologies
URI:	http://scholars.ntou.edu.tw/handle/123456789/3115
ISSN:	1521-3331
DOI:	10.1109/tcapt.2006.885927 ://WOS:000242688900002
Appears in Collections:	機械與機電工程學系

Show full item record

Last Week
0

Last month
0

checked on Oct 13, 2022

Check

DSpace CRIS